公告摘要
项目编号-
预算金额-
招标公司-
招标联系人-
标书截止时间-
投标截止时间-
公告正文
一、项目名称
20230529询价-外壳盖板散热片插座等
二、项目内容
1. XX项目
标的名称规格型号数量
12位数模转换器芯片HX7247677.00


1,973.00
ARINC659协议芯片HXA5932M35.00


594.00


771.00


1,300.00
CBGA312外壳MCPL1731-312A500.00
CCGA2208外壳MCPL6060-220880.00
CDFN08外壳CDFN08C7,500.00
CDIP08外壳CDIP08L(X射线)800.00

DIP08BN500.00


3,500.00

DIP08CB500.00


2,200.00
CDIP14外壳DIP14F(HT)500.00
CDIP16外壳CDIP16AK500.00


600.00


700.00

DIP16N1,000.00


1,500.00
CDIP16外壳及配套盖板D16S2-022,000.00
CDIP20外壳及配套盖板D20S2-023,000.00
CDIP24外壳DIP24AD500.00

DIP24C500.00
CDIP28外壳CDIP28T1,000.00

DIP28K500.00
CDIP36外壳DIP36A500.00
CDIP48外壳及配套盖板D48L2-01800.00
CFP08外壳FP08AL500.00
CFP10外壳CFP10M300.00


500.00
CFP14外壳FP14T500.00
CFP28外壳FP28P500.00
CGA624定制测试插座T-CGA624E1.27A15.00
CLCC05外壳LCC05R500.00

LCC05Y500.00
CLCC08外壳CLCC08W12,000.00
CLCC12外壳LCC12F500.00
CLCC18外壳及配套盖板C18F3-021,500.00
CLCC44外壳LCC44F500.00
CLGA117外壳CLGA117D500.00
CLGA196外壳CLGA196C500.00
CLGA256外壳CLGA256AM500.00
CLGA2577外壳CLGA2577400.00
CLGA337外壳CLGA337D500.00
CLGA484外壳及配套盖板CLGA484C1,000.00
CLGA625外壳FC-CLGA625B500.00
CPC61087老化插座B-QFN10A0.5A1350.00
CPGA70外壳MCPG2547-70500.00

MCPG2547-70A500.00

MCPG2547-70B500.00
CQDFP132封装定制插座T-CQFP132E0.635B010.00
CQFN03外壳CQFN033,000.00


3,500.00


5,000.00


5,500.00


6,000.00
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